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POLYFUSE ? Resettable PTCs
Surface Mount > 250S Series
Soldering Parameters
Pro?le Feature
Average Ramp-Up Rate (T S(max) to T P )
Temperature Min (T s(min) )
Pb-Free Assembly
3°C/second max
150°C
Pre Heat:
Time Maintained
Above:
Temperature Max (T s(max) )
Time (Min to Max) (t s )
Temperature (T L )
Temperature (t L )
200°C
60 – 180 secs
217°C
60 – 150 seconds
Peak / Classi?cation Temperature (T P )
Time within 5°C of actual peak
Temperature (t p )
Ramp-down Rate
260 +0/-5 °C
20 – 40 seconds
6°C/second max
-- All temperature refer to topside of the package, measured on the package body surface
Time 25°C to peak Temperature (T P )
Physical Speci?cations
8 minutes Max.
-- If re?ow temperature exceeds the recommended pro?le, devices may not meet the
performance requirements
-- Recommended re?ow methods: IR, vapor phase oven, hot air oven, N 2 environment
for lead
-- Recommended maximum paste thickness is 0.25mm (0.010inch)
-- Devices can be cleaned using standard industry methods and solvents
-- Devices can be reworked using the standard industry practices
Environmental Speci?cations
Terminal Material
Lead Solderability
?2009 Littelfuse, Inc.
Solder-Plated Copper (Solder Material:
Matte Tin(Sn))
Meets EIA Speci?cation RS186-9E, ANSI/
J-STD-002 Category 3.
59
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped State
Passive Aging
Humidity Aging
Thermal Shock
Solvent Resistance
Moisture Sensitivity Level
-40°C to +85°C
125°C -/+10oC
+85°C, 1000 hours
+85°C, 85%,R.H.,1000 hours
MIL–STD–202F, Method 107G
+125°C to -55°C 10 times
MIL–STD–202, Method 215F
Level 1, J–STD–020C
250S Series
Speci?cations are subject to change without notice.
Please refer to www.littelfuse.com/series/250S.html for current information.
Revised: November 30, 2009
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